IP Library Assignment 030274/0533
Patent Assignment
Reel/Frame 030274/0533

Assignment of Assignor's Interest

Recorded: 2013-04-24 Pages: 8
Assignors
ZHOU, WEIJUN
Executed: 2011-10-06
GU, BINGHE
Executed: 2011-10-07
LYONS, JOHN W.
Executed: 2011-10-07
POPA, PAUL J.
Executed: 2011-10-14
BULICK, ALLEN S.
Executed: 2012-09-24
KHANARIAN, GARO
Executed: 2012-09-20
ELL, JOHN R.
Executed: 2012-09-24
Assignees
ROHM AND HAAS ELECTRONIC MATERIALS LLC
455 FOREST STREET, MARLBOROUGH, MASSACHUSETTS, 01752
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Curable liquid composite light emitting diode encapsulant
Patent: 8,455,607 →
Application: 13/211,363 →
Publication: US 2013/0045292
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →