IP Library › Assignment 030313/0367
Patent Assignment
Reel/Frame 030313/0367

Assignment of Assignor's Interest

Recorded: 2013-04-26 Pages: 3
Assignors
ODA, KAZUNORI
Executed: 2013-04-18
YAZAKI, MASAKI
Executed: 2013-04-18
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property (1)
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 8,933,548 →
Application: 13/879,237 →
Publication: US 2013/0221509
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 6, 2026
From: DAI NIPPON PRINTING CO., LTD.
To: NICHIA CORPORATION
Reel/Frame 073992/0233 →
Corrective Assignment to Correct the Docket Number Previously Recorded on Reel 73992 Frame 233. Assignor(S) Hereby Confirms the Assignment . Mar 12, 2026
From: DAI NIPPON PRINTING CO., LTD.
To: NICHIA CORPORATION
Reel/Frame 075096/0339 →