Patent Assignment
Reel/Frame 073992/0233
Assignment of Assignor's Interest
Recorded: 2026-03-06
Pages: 4
Assignor
DAI NIPPON PRINTING CO., LTD.
Executed: 2026-02-24
Assignee
NICHIA CORPORATION
491-100 OKA, KAMINAKA-CHO,, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Properties
(7)
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 26, 2013
From: ODA, KAZUNORI; YAZAKI, MASAKI
To: DAI NIPPON PRINTING CO., LTD.
Reel/Frame 030313/0367 →
Corrective Assignment to Correct the Docket Number Previously Recorded on Reel 73992 Frame 233. Assignor(S) Hereby Confirms the Assignment .
Mar 12, 2026
From: DAI NIPPON PRINTING CO., LTD.
To: NICHIA CORPORATION
Reel/Frame 075096/0339 →