IP Library › Assignment 075096/0339
Patent Assignment
Reel/Frame 075096/0339

Corrective Assignment to Correct the Docket Number Previously Recorded on Reel 73992 Frame 233. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2026-03-12 Pages: 5
Assignor
DAI NIPPON PRINTING CO., LTD.
Executed: 2026-02-24
Assignee
NICHIA CORPORATION
491-100 OKA, KAMINAKA-CHO,, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Properties (7)
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 8,933,548 →
Application: 13/879,237 →
Publication: US 2013/0221509
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 9,159,655 →
Application: 14/452,971 →
Publication: US 2014/0349424
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 9,214,414 →
Application: 14/560,556 →
Publication: US 2015/0084177
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 9,362,473 →
Application: 14/823,610 →
Publication: US 2015/0349227
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 9,553,247 →
Application: 14/928,132 →
Publication: US 2016/0079504
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 9,773,960 →
Application: 15/182,011 →
Publication: US 2016/0293817
Lead Frame for Mounting Led Elements, Lead Frame with Resin, Method for Manufacturing Semiconductor Devices, and Lead Frame for Mounting Semiconductor Elements
Patent: 9,899,583 →
Application: 15/373,220 →
Publication: US 2017/0092830
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 26, 2013
From: ODA, KAZUNORI; YAZAKI, MASAKI
To: DAI NIPPON PRINTING CO., LTD.
Reel/Frame 030313/0367 →
Assignment of Assignor's Interest Mar 6, 2026
From: DAI NIPPON PRINTING CO., LTD.
To: NICHIA CORPORATION
Reel/Frame 073992/0233 →