Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
1. A lead frame for mounting LED elements, comprising:
a frame body region; and
a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a cutting region;
wherein the die pad and lead section in one package region are connected to the die pad and lead section in another package region longitudinally adjacent to the package region of interest, by a die pad connecting portion and a lead connecting portion, respectively;
wherein the die pad connecting portions and lead connecting portions positioned in a part of a plurality of cutting regions extending in a lateral direction are connected to each other by reinforcement pieces positioned in the part of the cutting regions; and
wherein, of all the cutting regions extending in the lateral direction, only those each provided with a reinforcement piece are cyclically formed at a predetermined number of alternate positions.
2. A lead frame for mounting LED elements, comprising:
a frame body region; and
a large number of package regions arranged in multiple rows and columns in the frame body region, the package regions each including a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a cutting region;
wherein the die pad and lead section in one package region are connected to the die pad and lead section in another package region longitudinally adjacent to the package region of interest, by a die pad connecting portion and a lead connecting portion, respectively;
wherein the die pad connecting portions and lead connecting portions positioned in a part of a plurality of cutting regions extending in a lateral direction are connected to each other by reinforcement pieces positioned in the part of the cutting regions; and
wherein, of all the cutting regions extending in the lateral direction, only those each provided with a reinforcement piece are formed irregularly.