Patent Assignment
Reel/Frame 030325/0752
Assignment of Assignor's Interest
Recorded: 2013-05-01
Pages: 2
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property
(1)
Die Bonder And Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.