Patent Assignment
Reel/Frame 030334/0034
Assignment of Assignor's Interest
Recorded: 2013-05-02
Pages: 4
Assignors
MASE, KEIJI
Executed: 2013-04-19
CHINO, DAISUKE
Executed: 2013-04-19
HINATA, MASATO
Executed: 2013-04-19
Assignee
FUJI MANUFACTURING CO., LTD.,
NO. 2-24, MATSUE 5-CHOME, EDOGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Device for Cutting Out Hard-Brittle Substrate and Protecting Regions on the Substrate