IP Library › Assignment 030363/0075
Patent Assignment
Reel/Frame 030363/0075

Assignment of Assignor's Interest

Recorded: 2013-05-07 Pages: 4
Assignors
KOHIKI, MICHIYA
Executed: 2013-04-15
MORIYAMA, TERUMASA
Executed: 2013-04-15
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8164, JAPAN
Covered Property (1)
Copper Foil for Printed Wiring Board, Method for Producing Said Copper Foil, Resin Substrate for Printed Wiring Board and Printed Wiring Board
Patent: 9,028,972 →
Application: 13/825,889 →
Publication: US 2013/0220685
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Feb 7, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 041649/0733 →
Change of Address Aug 11, 2021
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 057160/0114 →