IP Library › Assignment 030367/0062
Patent Assignment
Reel/Frame 030367/0062

Assignment of Assignor's Interest

Recorded: 2013-05-07 Pages: 4
Assignors
HUANG, XIN-HUA
Executed: 2013-04-24
LIU, PING-YIN
Executed: 2013-04-24
LIN, HUNG-HUA
Executed: 2013-04-24
KUANG, XIN-CHUNG
Executed: 2013-04-24
HSIEH, YUAN-CHIH
Executed: 2013-04-24
CHAO, LAN-LIN
Executed: 2013-04-24
TSAI, CHIA-SHIUNG
Executed: 2013-04-24
CHEN, XIAOMENG
Executed: 2013-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Integrate Rinse Module in Hybrid Bonding Platform
Patent: 9,446,467 →
Application: 13/888,921 →
Publication: US 2014/0263586
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Typographical Error in the Fourth Inventor's Name Previously Recorded on Reel 030367 Frame 0062. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Nov 9, 2016
From: HUANG, XIN-HUA; LIU, PING-YIN; LIN, HUNG-HUA; KUANG, HSUN-CHUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 040581/0666 →