IP Library › Assignment 040581/0666
Patent Assignment
Reel/Frame 040581/0666

Corrective Assignment to Correct the Typographical Error in the Fourth Inventor's Name Previously Recorded on Reel 030367 Frame 0062. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.

Recorded: 2016-11-09 Pages: 8
Assignors
HUANG, XIN-HUA
Executed: 2016-10-18
LIU, PING-YIN
Executed: 2016-10-18
LIN, HUNG-HUA
Executed: 2016-10-18
KUANG, HSUN-CHUNG
Executed: 2016-10-18
HSIEH, YUAN-CHIH
Executed: 2016-10-24
CHAO, LAN-LIN
Executed: 2016-10-18
TSAI, CHIA-SHIUNG
Executed: 2016-10-24
CHEN, XIAOMENG
Executed: 2016-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Integrate Rinse Module in Hybrid Bonding Platform
Patent: 9,446,467 →
Application: 13/888,921 →
Publication: US 2014/0263586
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 7, 2013
From: HUANG, XIN-HUA; LIU, PING-YIN; LIN, HUNG-HUA; KUANG, XIN-CHUNG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030367/0062 →