Patent Assignment
Reel/Frame 030411/0632
Assignment of Assignor's Interest
Recorded: 2013-05-14
Pages: 5
Assignors
CHIEN, VOLUME
Executed: 2013-04-22
CHENG, YUN-WEI
Executed: 2013-04-22
CHENG, I-I
Executed: 2013-04-22
JANGJIAN, SHIU-KO
Executed: 2013-04-22
JENG, CHI-CHERNG
Executed: 2013-04-22
HUANG, CHIH-MU
Executed: 2013-04-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Support Structure for Integrated Circuitry