Support structure for integrated circuitry
Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry.
1. A support structure for an integrated circuit, comprising:
a first trench structure formed within a substrate and comprising a first non-gaseous fill material, wherein:
the substrate has a first thickness and the first trench structure has a second thickness less than the first thickness, and
a top surface of the first trench structure is co-planar with a top surface of the substrate;
a second trench structure formed within the substrate and comprising a second non-gaseous fill material, wherein:
the second trench structure has a third thickness less than the first thickness, and
a bottom surface of the second trench structure is co-planar with a bottom surface of the substrate; and
an anti-reflective coating overlying the first trench structure and the second trench structure.
2. The support structure of claim 1 , wherein the support structure is formed along a periphery of the integrated circuit.
3. The support structure of claim 1 , wherein the anti-reflective coating is in contact with a top surface of the first trench structure.
4. The support structure of claim 1 , wherein the first non-gaseous fill material and the second non-gaseous fill material are a same material.
5. The support structure of claim 1 , wherein:
the first trench structure is formed as a first ring around the integrated circuit,
the second trench structure is formed as a second ring around the integrated circuit, and
the first ring is concentric with the second ring.
6. The support structure of claim 1 , wherein the substrate comprises a middle region between the first trench structure and the second trench structure.
7. The support structure of claim 1 , wherein the second thickness is equal to the third thickness.
8. The support structure of claim 1 , comprising a dielectric layer overlying the anti-reflective coating.
9. The support structure of claim 8 , comprising a buffer layer between the anti-reflective coating and the dielectric layer.
10. The support structure of claim 1 , wherein a non-linear pathway is defined in the substrate that extends under the first trench structure and over the second trench structure.
11. The support structure of claim 1 , wherein the anti-reflective coating is spaced apart from a top surface of the second trench structure.
12. A support structure for an integrated circuit, comprising:
a first trench structure defining a first segmented ring and formed within a substrate, wherein:
the first trench structure comprises a first non-gaseous fill material,
the first trench structure surrounds the integrated circuit, and
a top surface of the first trench structure is co-planar with a top surface of the substrate; and
a second trench structure defining a second segmented ring and formed within the substrate, wherein:
the second trench structure comprises a second non-gaseous fill material,
the second trench structure surrounds the integrated circuit,
the second segmented ring is concentric with the first segmented ring, and
a bottom surface of the second trench structure is co-planar with a bottom surface of the substrate.
13. The support structure of claim 12 , wherein:
the substrate has a first thickness, and
the first trench structure has a second thickness less than the first thickness.
14. The support structure of claim 12 , wherein the first trench structure and the second trench structure extend through the substrate.
15. The support structure of claim 12 , wherein a first segment of the first segmented ring is separated from a second segment of the first segmented ring by a portion of the substrate.
16. The support structure of claim 15 , wherein a first segment of the second segmented ring overlaps the portion of the substrate, the first segment of the first segmented ring, and the second segment of the first segmented ring.
17. The support structure of claim 12 , wherein at least one of the first non-gaseous fill material or the second non-gaseous fill material is a dielectric material.
18. A support structure for an integrated circuit, comprising:
a first trench structure formed within a substrate and comprising a first non-gaseous fill material, wherein:
the substrate has a first thickness and the first trench structure has a second thickness less than the first thickness, and
a top surface of the first trench structure is co-planar with a top surface of the substrate; and
a second trench structure formed within the substrate and comprising a second non-gaseous fill material, wherein:
the second trench structure has a third thickness less than the first thickness, and
a bottom surface of the second trench structure is co-planar with a bottom surface of the substrate.
19. The support structure of claim 18 , wherein the first non-gaseous fill material and the second non-gaseous fill material are a same material.
20. The support structure of claim 18 , wherein the second thickness is equal to the third thickness.