IP Library › Assignment 030434/0968
Patent Assignment
Reel/Frame 030434/0968

Assignment of Assignor's Interest

Recorded: 2013-05-17 Pages: 4
Assignors
WANG, ZHIWEI
Executed: 2013-04-22
MAO, JIANHONG
Executed: 2013-04-22
ZHANG, LEI
Executed: 2013-04-22
TANG, DEMING
Executed: 2013-04-22
Assignee
LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
3000 LONG DONG AVE, BUILDING #5, SUITE 501B, ZHANGJIANG HIGH TECH PARK, SHANGHAI, 201203, CHINA
Covered Property (1)
Method for Low Temperature Wafer Bonding and Bonded Structure
Patent: 8,802,541 →
Application: 13/896,593 →
Publication: US 2013/0307165
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 14, 2016
From: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037970/0280 →
Assignment of Assignor's Interest Apr 10, 2020
From: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.; NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 052364/0956 →
Assignment of Assignor's Interest Apr 23, 2020
From: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.; NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
To: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 052475/0276 →