IP Library › Assignment 052475/0276
Patent Assignment
Reel/Frame 052475/0276

Assignment of Assignor's Interest

Recorded: 2020-04-23 Pages: 3
Assignors
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, 315800, CHINA
Covered Property (1)
Method for Low Temperature Wafer Bonding and Bonded Structure
Patent: 8,802,541 →
Application: 13/896,593 →
Publication: US 2013/0307165
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2013
From: WANG, ZHIWEI; MAO, JIANHONG; ZHANG, LEI; TANG, DEMING
To: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
Reel/Frame 030434/0968 →
Assignment of Assignor's Interest Mar 14, 2016
From: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037970/0280 →
Assignment of Assignor's Interest Apr 10, 2020
From: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.; NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 052364/0956 →