Patent Assignment
Reel/Frame 052364/0956
Assignment of Assignor's Interest
Recorded: 2020-04-10
Pages: 4
Assignor
XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Executed: 2020-04-08
Assignees
XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO.204, CIRCULAR ARC BUILDING, NO.60, WEST ROAD, NEW INDUSTRIAL PARK, HIGH-TECH ZONE, XI'AN, 710119, CHINA
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, 315800, CHINA
Covered Property
(1)
Method for Low Temperature Wafer Bonding and Bonded Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 17, 2013
From: WANG, ZHIWEI; MAO, JIANHONG; ZHANG, LEI; TANG, DEMING
To: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
Reel/Frame 030434/0968 →
Assignment of Assignor's Interest
Mar 14, 2016
From: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
To: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037970/0280 →
Assignment of Assignor's Interest
Apr 23, 2020
From: XI'AN YISHEN OPTOELECTRONICS TECHNOLOGY CO., LTD.; NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
To: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 052475/0276 →