IP Library › Assignment 030451/0398
Patent Assignment
Reel/Frame 030451/0398

Assignment of Assignor's Interest

Recorded: 2013-05-17 Pages: 7
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Semiconductor Package with Interconnect Layers
Patent: 8,492,870 →
Application: 13/159,190 →
Publication: US 2011/0309473
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030451/0410 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →