IP Library › Assignment 030451/0410
Patent Assignment
Reel/Frame 030451/0410

Assignment of Assignor's Interest

Recorded: 2013-05-17 Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2002-01-18
LEE, JIN-YUAN
Executed: 2002-01-01
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property (1)
Semiconductor Package with Interconnect Layers
Patent: 8,492,870 →
Application: 13/159,190 →
Publication: US 2011/0309473
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 17, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030451/0398 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →