Patent Assignment
Reel/Frame 030477/0960
Assignment of Assignor's Interest
Recorded: 2013-05-23
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2013-05-16
HUNG, JUI-PIN
Executed: 2013-05-16
LIU, HSIEN-WEN
Executed: 2013-05-16
LIN, MIN-CHEN
Executed: 2012-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination