Patent Assignment
Reel/Frame 030485/0246
Assignment of Assignor's Interest
Recorded: 2013-05-24
Pages: 5
Assignors
JEON, BYUNG JUN
Executed: 2013-05-07
LEE, BYOUNG HWA
Executed: 2013-05-07
GU, HYUN HEE
Executed: 2013-05-07
KIM, CHANG HOON
Executed: 2013-05-07
AHN, YOUNG GHYU
Executed: 2013-05-07
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayered Chip Electronic Component and Board for Mounting the Same