IP Library › Assignment 030527/0146
Patent Assignment
Reel/Frame 030527/0146

Assignment of Assignor's Interest

Recorded: 2013-05-31 Pages: 11
Assignors
LAN, JE-HSIUNG
Executed: 2013-05-17
NOWAK, MATTHEW MICHAEL
Executed: 2013-05-17
GOUSEV, EVGENI PETROVICH
Executed: 2013-05-17
KIM, JONGHAE
Executed: 2013-05-17
CHUI, CLARENCE
Executed: 2013-05-31
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
High Density Metal-Insulator-Metal Trench Capacitor
Patent: 8,492,874 →
Application: 13/021,151 →
Publication: US 2012/0199949
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 4, 2011
From: LAN, JE-HSIUNG; NOWAK, MATTHEW MICHAEL; GOUSEV, EVGENI P.; KIN, JONGHAE
To: QUALCOMM INCORPORATED
Reel/Frame 025746/0420 →