Patent Assignment
Reel/Frame 030554/0147
Assignment of Assignor's Interest
Recorded: 2013-06-05
Pages: 8
Assignors
ZENG, FAN-QING
Executed: 2013-03-26
TEY, CHING HWA
Executed: 2013-03-26
XU, XIAOQING
Executed: 2013-03-26
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Seal Ring Structure with a V-Shaped Dielectric Layer Conformally Overlapping a Conductive Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.