Patent Assignment
Reel/Frame 030610/0838
Assignment of Assignor's Interest
Recorded: 2013-06-14
Pages: 16
Assignors
CHEN, LI-CHE
Executed: 2013-06-06
WU, TE-YUAN
Executed: 2013-06-06
LIN, CHIA-HUEI
Executed: 2013-06-06
WU, HUI-MIN
Executed: 2013-06-06
HSIEH, KUN-CHE
Executed: 2013-06-06
WANG, KUAN-YU
Executed: 2013-06-06
CHIU, CHUNG-YI
Executed: 2013-06-06
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Forming Mems Structure with an Etch Stop Layer Buried Within Inter-Dielectric Layer