Patent Assignment
Reel/Frame 030669/0022
Assignment of Assignor's Interest
Recorded: 2013-06-24
Pages: 4
Assignor
LEE, SANG-MIN
Executed: 2013-06-14
Assignee
SAMSUNG TECHWIN CO., LTD.
28, SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Circuit Board and Chip Package and Circuit Board Manufactured by Using the Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.