IP Library › Assignment 030675/0664
Patent Assignment
Reel/Frame 030675/0664

Assignment of Assignor's Interest

Recorded: 2013-06-25 Pages: 10
Assignors
MEYER, THORSTEN
Executed: 2013-05-29
OFNER, GERALD
Executed: 2013-05-29
MUELLER, CHRISTIAN
Executed: 2013-06-03
MAHNKOPF, REINHARD
Executed: 2013-06-03
GEISSLER, CHRISTIAN
Executed: 2013-05-29
AUGUSTIN, ANDREAS
Executed: 2013-06-03
Assignee
INTEL MOBILE COMMUNICATIONS GMBH
AM CAMPEON 10-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Chip Arrangement and Method for Manufacturing a Chip Arrangement
Patent: 9,856,136 →
Application: 13/910,133 →
Publication: US 2014/0361387
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest Jul 20, 2020
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 053257/0615 →
Assignment of Assignor's Interest Nov 6, 2020
From: INTEL CORPORATION
To: SONY CORPORATION
Reel/Frame 054340/0280 →