Patent Assignment
Reel/Frame 053257/0615
Assignment of Assignor's Interest
Recorded: 2020-07-20
Pages: 6
Assignor
INTEL DEUTSCHLAND GMBH
Executed: 2020-07-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Chip Arrangement and Method for Manufacturing a Chip Arrangement
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2013
From: MEYER, THORSTEN; OFNER, GERALD; MUELLER, CHRISTIAN; MAHNKOPF, REINHARD
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 030675/0664 →
Change of Name
Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest
Nov 6, 2020
From: INTEL CORPORATION
To: SONY CORPORATION
Reel/Frame 054340/0280 →