Assignment of Assignor's Interest

Recorded: 2013-06-28 Pages: 9

Assignors

DO, BYUNG TAI

Executed: 2013-06-06

TRASPORTO, ARNEL SENOSA

Executed: 2013-06-06

CHUA, LINDA PEI EE

Executed: 2013-06-06

YUSOF, ASRI

Executed: 2013-06-06

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Leadframe and Method of Manufacture Thereof

Patent: 9,190,349 →

Application: 13/930,261 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.