Integrated circuit packaging system with leadframe and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing an unplated leadframe having a contact protrusion;

depositing a solder resist on the contact protrusion;

forming a contact pad and traces by etching the unplated leadframe;

applying a trace protection layer directly on the contact pad and the traces;

removing the solder resist;

forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and

depositing an external connector directly on the top surface of the contact pad.

2. The method as claimed in claim 1 further comprising:

connecting an integrated circuit die to the contact protrusion; and

depositing an encapsulation on the integrated circuit die and the unplated leadframe.

3. The method as claimed in claim 1 wherein depositing the solder resist includes:

providing on a dipping surface the solder resist; and

dipping the contact protrusion into the solder resist.

4. The method as claimed in claim 1 wherein depositing the solder resist includes:

positioning a patterned screen above the contact protrusion;

applying the solder resist through the patterned screen on the contact protrusion; and

removing the patterned screen.

5. The method as claimed in claim 1 wherein depositing the solder resist includes:

applying the solder resist to a coating pin;

positioning the coating pin above the contact protrusion; and

pressing the solder resist on the contact protrusion by pressing the coating pin towards the contact protrusion.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing an unplated leadframe having a contact protrusion;

connecting an integrated circuit die to the contact protrusion;

depositing an encapsulation on the integrated circuit die and the unplated leadframe;

depositing a solder resist on the contact protrusion;

forming a contact pad and traces by etching the unplated leadframe;

applying a trace protection layer directly on the contact pad and the traces;

removing the solder resist;

forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and

depositing an external connector directly on the top surface of the contact pad.

7. The method as claimed in claim 6 wherein etching the top surface of the contact pad includes etching the top surface of the contact pad without creating defects.

8. The method as claimed in claim 6 wherein removing the solder resist includes removing the solder resist and a portion of the trace protection layer with a buffing process.

9. The method as claimed in claim 6 wherein removing the solder resist includes removing the solder resist and a portion of the trace protection layer with chemical mechanical planarization.

10. The method as claimed in claim 6 wherein applying the trace protection layer includes applying the trace protection layer on the traces, the encapsulation, and the contact pad.

11. An integrated circuit packaging system comprising:

a contact pad;

traces connected to the contact pad;

a trace protection layer directly on the contact pad and the traces, the trace protection layer having a recess with a top surface of the contact pad a recess distance below a top surface of the trace protection layer; and

an external connector directly on the top surface of the contact pad.

12. The system as claimed in claim 11 further comprising:

an integrated circuit die connected to the contact pad; and

an encapsulation on the integrated circuit die and the contact pad.

13. The system as claimed in claim 11 wherein the contact pad and traces are formed from copper.

14. The system as claimed in claim 11 wherein the contact pad is without a plating layer.

15. The system as claimed in claim 11 wherein the external connector is in the recess.

16. The system as claimed in claim 11 further comprising:

an integrated circuit die connected to the contact pad; and

an encapsulation on the integrated circuit die and the contact pad;

wherein:

the contact pad is without a plating layer.

17. The system as claimed in claim 16 wherein the top surface of the contact pad is without defects.

18. The system as claimed in claim 16 wherein the contact pad has curved sides.

19. The system as claimed in claim 16 wherein the external connector is a solder ball.

20. The system as claimed in claim 16 wherein the trace protection layer is translucent.