Patent Assignment
Reel/Frame 030709/0817
Assignment of Assignor's Interest
Recorded: 2013-06-28
Pages: 9
Assignors
DIMACULANGAN, GARRET
Executed: 2013-06-03
CHUA, LINDA PEI EE
Executed: 2013-06-03
DO, BYUNG TAI
Executed: 2013-06-03
TRASPORTO, ARNEL SENOSA
Executed: 2013-06-03
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Unplated Leadframe and Method of Manufacture Thereof
Patent:
9,620,480 →
Application:
13/930,287 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.