Integrated circuit packaging system with unplated leadframe and method of manufacture thereof
An integrated circuit packaging system and method of manufacture thereof including: providing an unplated leadframe having a contact protrusion; forming a contact pad and traces by etching the unplated leadframe; applying a trace protection layer on the contact pad and the traces; forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and depositing an external connector directly on the top surface of the contact pad.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a contact pad and traces by etching an unplated leadframe, the unplated leadframe having a contact protrusion;
applying a trace protection layer on the contact pad and the traces;
forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and
depositing an external connector directly on the top surface of the contact pad.
2. The method as claimed in claim 1 further comprising:
connecting an integrated circuit die to the contact protrusion; and
depositing an encapsulation on the integrated circuit die and the unplated leadframe.
3. The method as claimed in claim 1 wherein forming the contact pad and the traces includes forming the contact pad and the traces using an anisotropic etching process.
4. The method as claimed in claim 1 wherein depositing the external connector includes depositing the external connector in the recess.
5. The method as claimed in claim 1 further comprising cleaning the contact pad and the traces using a plasma cleaning process.
6. A method of manufacture of an integrated circuit packaging system comprising:
connecting an integrated circuit die to a contact protrusion of an unplated leadframe;
depositing an encapsulation on the integrated circuit die and the unplated leadframe;
forming a contact pad and traces by etching the unplated leadframe;
applying a trace protection layer on the contact pad and the traces;
forming a recess in the trace protection layer by etching a top surface of the contact pad to a recess distance below a top surface of the trace protection layer; and
depositing an external connector directly on the top surface of the contact pad.
7. The method as claimed in claim 6 wherein etching the top surface of the contact pad includes etching the top surface of the contact pad without creating defects, the top surface having a concave surface.
8. The method as claimed in claim 6 wherein forming the recess includes removing a portion of the trace protection layer with a buffing process.
9. The method as claimed in claim 6 wherein forming the recess includes removing a portion of the contact pad and a portion of the trace protection layer with chemical mechanical planarization.
10. The method as claimed in claim 6 wherein applying the trace protection layer includes applying the trace protection layer on the traces, the encapsulation, and the contact pad.