Patent Assignment
Reel/Frame 030746/0036
Assignment of Assignor's Interest
Recorded: 2013-07-06
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2013-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Method and Apparatus for Connecting Packages Onto Printed Circuit Boards
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.