Patent Assignment
Reel/Frame 030753/0718
Assignment of Assignor's Interest
Recorded: 2013-07-08
Pages: 6
Assignors
TSAI, SHU-TING
Executed: 2013-07-03
LIN, JENG-SHYAN
Executed: 2013-07-03
YAUNG, DUN-NIAN
Executed: 2013-07-03
LIU, JEN-CHENG
Executed: 2013-07-03
HUNG, FENG-CHI
Executed: 2013-07-03
HUANG, CHIH-HUI
Executed: 2013-07-03
CHEN, SHENG-CHAU
Executed: 2013-07-03
CHOU, SHIH PEI
Executed: 2013-07-03
LIN, CHIA-CHIEH
Executed: 2013-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure for Stacked Device