IP Library › Assignment 030759/0629
Patent Assignment
Reel/Frame 030759/0629

Assignment of Assignor's Interest

Recorded: 2013-07-09 Pages: 3
Assignor
HITACHI CABLE, LTD.
Executed: 2013-03-01
Assignee
SH COPPER PRODUCTS CO., LTD.
3550, KIDAMARI, TSUCHIURA, IBARAKI, 300-0026, JAPAN
Covered Properties (3)
Copper Foil for Printed Circuit Board, Method for Fabricating Same, and Trivalent Chromium Conversion Treatment Solution Used for Fabricating Same
Patent: 7,344,785 →
Application: 11/249,452 →
Publication: US 2006/0257680
Copper Alloy Material and a Method for Fabricating the Same
Patent: 8,137,489 →
Application: 12/457,727 →
Publication: US 2010/0224292
Copper Alloy Material and Method of Making Same
Patent: 8,361,255 →
Application: 12/603,804 →
Publication: US 2010/0037996
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 14, 2005
From: KODAIRA, MUNEO; WATANABE, SHINGO; SASAKI, GEN; ITO, YASUYUKI
To: HITACHI CABLE, LTD.
Reel/Frame 017095/0096 →
Assignment of Assignor's Interest Aug 11, 2009
From: MUROGA, TAKEMI; HAGIWARA, NOBORU; YAMAMOTO, YOSHIKI
To: HITACHI CABLE, LTD.
Reel/Frame 023080/0249 →
Assignment of Assignor's Interest Nov 30, 2015
From: SH COPPER PRODUCTS CO., LTD.
To: CHANG CHUN PETROCHEMICAL CO., LTD.
Reel/Frame 037169/0165 →