Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
A copper foil 1 comprises a roughened plating layer 2 , a Ni—Co alloy plating layer 3 , a zinc galvanized (underlying) layer 4 , a chromate treatment layer 5 , and a silane coupling treatment layer 6 on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer 5 is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.
1. A copper foil for a printed circuit board comprising:
a copper foil comprising copper or copper alloy and having a surface to be faced to a base material for a printed circuit board;
a zinc galvanized layer provided on a bonding surface of the copper foil; and
a trivalent chromate treatment layer directly formed on the zinc galvanized layer;
wherein the trivalent chromate treatment layer is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5; and
wherein an alloy plating layer composed of Ni and Co is provided between the zinc galvanized layer and the copper foil, and wherein a total coating amount of the Ni and Co is 5 to 20 μg/cm 2 , and a concentration of the cobalt in the alloy layer is 60 to 80 mass %.
2. A copper foil for a printed circuit board comprising:
a copper foil comprising copper or a copper alloy and having a surface to be faced to a base material for a printed circuit board;
a zinc galvanized layer provided on a bonding surface of the copper foil; and
a trivalent chromate treatment layer directly formed on the zinc galvanized layer;
wherein the trivalent chromate treatment layer is formed as a trivalent chromate film by using a trivalent chromium conversion treatment solution comprising 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5,
wherein the trivalent chromium conversion treatment solution is substantially free of hexavalent chromium ions,
wherein the trivalent chromium comprises nitric acid chromium, chromium sulfate, or chromium chloride, and
wherein an alloy plating layer composed of Ni and Co is provided between the zinc galvanized layer and the copper foil.
3. The copper foil for a printed circuit board, according to claim 2 , wherein:
a coating amount of the Zn of the zinc galvanized layer is 0.5 to 3 μg/cm 2 .
4. A copper foil according to claim 2 , wherein the treatment solution comprises 110 mg/L or more and 400 mg/L or less of trivalent chromium ions.
5. A copper foil according to claim 2 , wherein the treatment solution comprises 150 mg/L or more and 300 mg/L or less of trivalent chromium ions.
6. A copper foil according to claim 2 , wherein the pH value of the chromate treatment solution is between 3.5 and 4.0.
7. A copper foil according to claim 2 , wherein the pH value of the chromate treatment solution is between 3.6 and 3.8.
8. A printed circuit board comprising the copper foil according to claim 2 .