Patent Assignment
Reel/Frame 030761/0445
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 4
Assignors
HUANG, KUEI-WEI
Executed: 2013-06-10
LIN, CHIH-WEI
Executed: 2013-06-10
LIN, HSIU-JEN
Executed: 2013-06-10
LIN, WEI-HUNG
Executed: 2013-06-10
CHENG, MING-DA
Executed: 2013-06-10
LIU, CHUNG-SHI
Executed: 2013-06-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package-on-Package Structures and Methods for Forming the Same