Patent Assignment
Reel/Frame 030764/0973
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 2
Assignors
LIN, MOU-SHIUNG
Executed: 2006-07-20
CHOU, CHIEN-KANG
Executed: 2006-07-20
CHEN, KE-HUNG
Executed: 2006-07-20
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Post Passivation Structure for a Semiconductor Device and Packaging Process for Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 11, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030774/0280 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →