IP Library › Assignment 030774/0280
Patent Assignment
Reel/Frame 030774/0280

Assignment of Assignor's Interest

Recorded: 2013-07-11 Pages: 3
Assignor
MEGIC CORPORATION
Executed: 2006-10-17
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Post Passivation Structure for a Semiconductor Device and Packaging Process for Same
Patent: 8,558,383 →
Application: 12/264,271 →
Publication: US 2009/0057895
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2013
From: LIN, MOU-SHIUNG; CHOU, CHIEN-KANG; CHEN, KE-HUNG
To: MEGIC CORPORATION
Reel/Frame 030764/0973 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →