IP Library › Assignment 030769/0745
Patent Assignment
Reel/Frame 030769/0745

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 4
Assignors
LEE, JIN-YUAN
Executed: 2001-08-01
LEI, MING-TA
Executed: 2001-08-01
HUANG, CHING-CHENG
Executed: 2001-08-01
LIN, CHUEN-JYE
Executed: 2001-08-01
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Low Fabrication Cost, High Performance, High Reliability Chip Scale Package
Patent: 7,338,890 →
Application: 11/136,650 →
Publication: US 2005/0215043
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →