Patent Assignment
Reel/Frame 030770/0685
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 6
Assignors
MAKINO, RYOHEI
Executed: 2013-06-27
KUMADA, TAKAO
Executed: 2013-06-27
EDO, MASAHARU
Executed: 2013-06-27
TAKAKI, KEISHI
Executed: 2013-07-01
Assignee
ADVANCED POWER DEVICE RESEARCH ASSOCIATION
4-3, OKANO 2-CHOME, NISHI-KU, YOKOHAMA-SHI, KANAGAWA, 220-0073, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Wafer, and Semiconductor Wafer
Application:
13/938,749 →
Publication:
US 2014/0284660
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.