Patent Assignment
Reel/Frame 030780/0986
Assignment of Assignor's Interest
Recorded: 2013-07-11
Pages: 5
Assignor
HU, CHUAN
Executed: 2012-08-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Device with Pre-Molding Chip Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.