Patent Assignment
Reel/Frame 030826/0770
Assignment of Assignor's Interest
Recorded: 2013-07-18
Pages: 4
Assignors
PENG, HE-HUI
Executed: 2013-07-08
HUANG, FU-MING
Executed: 2013-07-08
SUEN, SHICH-CHANG
Executed: 2013-07-08
KUO, HAN-HSIN
Executed: 2013-07-08
TSAI, CHI-MING
Executed: 2013-07-08
CHEN, LIANG-GUANG
Executed: 2013-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Removing Debris from Polishing Pad