IP Library › Assignment 030942/0093
Patent Assignment
Reel/Frame 030942/0093

Assignment of Assignor's Interest

Recorded: 2013-08-05 Pages: 5
Assignors
SHIN, DONG-IL
Executed: 2013-07-29
BAE, IN-SEOB
Executed: 2013-07-29
PARK, SE-CHUEL
Executed: 2013-07-29
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, JAPAN
Covered Property (1)
Lead Frame, Semiconductor Package Including the Lead Frame, and Method of Manufacturing the Lead Frame
Patent: 9,171,789 →
Application: 13/958,980 →
Publication: US 2014/0252580
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 16, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO. LTD.
Reel/Frame 033327/0442 →
Change of Name Apr 21, 2015
From: MDS CO. LTD.
To: HAESUNG DS CO., LTD.
Reel/Frame 035475/0415 →