Patent Assignment
Reel/Frame 030967/0523
Assignment of Assignor's Interest
Recorded: 2013-08-08
Pages: 2
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Device for Holding Multiple Semiconductor Devices During Thermocompression Bonding and Method of Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.