IP Library › Assignment 031001/0493
Patent Assignment
Reel/Frame 031001/0493

Assignment of Assignor's Interest

Recorded: 2013-08-13 Pages: 8
Assignor
INTERNATIONAL BUSINESS MACHINES
Executed: 2013-08-05
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties (3)
Electrical Interconnect Forming Method
Patent: 8,541,299 →
Application: 12/787,527 →
Publication: US 2010/0230475
Thermo-Compression Bonded Electrical Interconnect Structure and Method
Patent: 8,541,291 →
Application: 13/159,773 →
Publication: US 2011/0239458
Underfill Flow Guide Structures and Method of Using Same
Patent: 8,580,673 →
Application: 13/736,627 →
Publication: US 2013/0122661
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 8, 2013
From: DAUBENSPECK, TIMOTHY H.; GAMBINO, JEFFREY P.; MUZZY, CHRISTOPHER D.; PAQUET, MARIE-CLAUDE
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 029589/0420 →
Assignment of Assignor's Interest Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0735 →
Assignment of Assignor's Interest Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →