Patent Assignment
Reel/Frame 031039/0015
Assignment of Assignor's Interest
Recorded: 2013-08-19
Pages: 8
Assignor
INTERNATIONAL BUSINESS MACHINES
Executed: 2013-08-05
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(10)
Method of Injection Molded Flip Chip Encapsulation
Patent:
6,407,461 →
Application:
08/884,228 →
Electronic Package Fpr Electronic Components and Method of Making Same
Patent:
6,351,393 →
Application:
09/346,356 →
Electronic Package with High Density Interconnect Layer
Patent:
6,373,717 →
Application:
09/540,172 →
Method of Making an Electronic Package
Electronic Package with Optimized Lamination Process
Localized Temperature Control During Rapid Thermal Anneal
Localized Temperature Control During Rapid Thermal Anneal
Methodology for Recovery of Hot Carrier Induced Degradation in Bipolar Devices
Method and Process for Reducing Undercooling in a Lead-Free Tin-Rich Solder Alloy
Mounting Method for Semiconductor Parts on Circuit Substrate
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.