Patent Assignment
Reel/Frame 031051/0287
Assignment of Assignor's Interest
Recorded: 2013-08-21
Pages: 13
Assignors
KIM, SUNG KYU
Executed: 2013-07-31
KIM, JIN YOUNG
Executed: 2013-07-31
KIM, YOON JOO
Executed: 2013-08-05
KIM, JIN HAN
Executed: 2013-07-31
LEE, SEUNG JAE
Executed: 2013-07-31
CHA, SE WOONG
Executed: 2013-08-02
BAE, JAE HUN
Executed: 2013-08-05
KIM, DONG JIN
Executed: 2013-07-31
KI, WON MYOUNG
Executed: 2013-07-31
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Wafer Level Fan-Out Package with a Fiducial Die
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →