Patent Assignment
Reel/Frame 031067/0794
Assignment of Assignor's Interest
Recorded: 2013-08-23
Pages: 12
Assignors
YOO, DONGCHUL
Executed: 2013-08-07
NAM, PHIL OUK
Executed: 2013-08-07
LEE, WOONG
Executed: 2013-08-07
YANG, JUNKYU
Executed: 2013-08-08
LEE, WOOSUNG
Executed: 2013-08-07
KIM, JINGYUN
Executed: 2013-08-07
EOM, DAEHONG
Executed: 2013-08-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device and Method for Fabricating the Same