IP Library Assignment 031070/0185
Patent Assignment
Reel/Frame 031070/0185

Assignment of Assignor's Interest

Recorded: 2013-08-23 Pages: 4
Assignors
SHIH, PO-CHENG
Executed: 2013-08-13
LIOU, JOUNG-WEI
Executed: 2013-08-19
SUN, CHIH-HUNG
Executed: 2013-08-13
CHOU, CHIA CHENG
Executed: 2013-08-13
HSU, KUANG-YUAN
Executed: 2013-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Interconnect Structure and Method for Forming the Same
Patent: 8,993,442 →
Application: 13/974,430 →
Publication: US 2015/0056802
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →