Patent Assignment
Reel/Frame 031081/0559
Assignment of Assignor's Interest
Recorded: 2013-08-26
Pages: 7
Assignors
KIM, TAE HONG
Executed: 2013-08-12
MCALLISTER, MICHAEL F.
Executed: 2013-08-09
SHAPIRO, MICHAEL J.
Executed: 2013-08-23
SPROGIS, EDMUND J.
Executed: 2013-08-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD RD., ARMONK, NEW YORK, 10504
Covered Property
(1)
Integrated Decoupling Capacitor Employing Conductive Through-Substrate Vias
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0439 →
Change of Name
Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0823 →