Patent Assignment
Reel/Frame 031095/0122
Assignment of Assignor's Interest
Recorded: 2013-08-27
Pages: 4
Assignors
HUANG, YU-LUNG
Executed: 2013-07-30
LIN, CHAO-YEN
Executed: 2013-07-30
SUEN, WEI-LUEN
Executed: 2013-07-30
CHEN, CHIEN-HUI
Executed: 2013-07-30
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same