IP Library Assignment 031098/0818
Patent Assignment
Reel/Frame 031098/0818

Assignment of Assignor's Interest

Recorded: 2013-07-25 Pages: 3
Assignors
TRPUSEEMA, DAN
Executed: 2013-07-08
RUSSELL, JAMES V.
Executed: 2013-07-08
Assignee
R&D CIRCUITS, INC.
3601 SOUTH CLINTON AVE., SOUTH PLAINFIELD, NEW JERSEY, 07080-1322
Covered Property (1)
Method and structure for forming contact pads on a printed circuit board using zero under cut technology
Patent: 9,468,108 →
Application: 13/987,440 →
Publication: US 2014/0069704
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2015
From: R & D CIRCUITS; R&D ALTANOVA, INC.
To: ABACUS FINANCE GROUP, LLC
Reel/Frame 035302/0394 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 035302 Frame: 0394. Assignor(S) Hereby Confirms the Security Interest. Apr 14, 2015
From: R & D CIRCUITS; R&D ALTANOVA, INC.
To: ABACUS FINANCE GROUP, LLC
Reel/Frame 035552/0670 →
Assignment of Assignor's Interest Jun 8, 2021
From: R&D CIRCUITS, INC.; R&D CIRCUITS INC.; R&D CIRCUITS,INC.
To: R&D CIRCUITS
Reel/Frame 056464/0411 →
Release of Security Interest Nov 18, 2021
From: ABACUS FINANCE GROUP, LLC
To: R & D CIRCUITS; R&D ALTANOVA, INC.
Reel/Frame 058151/0588 →